The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 13, 2016

Filed:

May. 22, 2013
Applicant:

Entegris, Inc., Billerica, MA (US);

Inventors:

Thomas M. Cameron, Newtown, CT (US);

Susan V. DiMeo, New City, NY (US);

Bryan C. Hendrix, Danbury, CT (US);

Weimin Li, New Milford, CT (US);

Assignee:

ENTEGRIS, INC., Billerica, MA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 21/28 (2006.01); C07F 7/10 (2006.01); C23C 16/34 (2006.01); C23C 16/40 (2006.01); C09D 5/24 (2006.01); C23C 16/44 (2006.01); C23C 16/455 (2006.01); H01L 49/02 (2006.01); H01L 29/51 (2006.01);
U.S. Cl.
CPC ...
H01L 21/28229 (2013.01); C07F 7/10 (2013.01); C09D 5/24 (2013.01); C23C 16/345 (2013.01); C23C 16/401 (2013.01); C23C 16/402 (2013.01); C23C 16/44 (2013.01); C23C 16/45525 (2013.01); H01L 28/40 (2013.01); H01L 29/516 (2013.01);
Abstract

A silicon precursor composition is described, including a silylene compound selected from among: silylene compounds of the formula: wherein each of R and Ris independently selected from organo substituents; amidinate silylenes; and bis(amidinate) silylenes. The silylene compounds are usefully employed to form high purity, conformal silicon-containing films of SiO, SiN, SiC and doped silicates in the manufacture of microelectronic device products, by vapor deposition processes such as CVD, pulsed CVD, ALD and pulsed plasma processes. In one implementation, such silicon precursors can be utilized in the presence of oxidant, to seal porosity in a substrate comprising porous silicon oxide by depositing silicon oxide in the porosity at low temperature, e.g., temperature in a range of from 50° C. to 200° C.


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