The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 13, 2016

Filed:

Aug. 15, 2014
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Swaminathan T. Srinivasan, Pleasanton, CA (US);

Atif M. Noori, Saratoga, CA (US);

David K. Carlson, San Jose, CA (US);

Assignee:

APPLIED MATERIALS, INC., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); H01L 21/67 (2006.01); H01L 21/324 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02664 (2013.01); H01L 21/02532 (2013.01); H01L 21/02538 (2013.01); H01L 21/67011 (2013.01); H01L 21/6719 (2013.01); H01L 21/67098 (2013.01); H01L 21/67115 (2013.01); H01L 21/67207 (2013.01); H01L 21/67248 (2013.01); H01L 21/0237 (2013.01); H01L 21/02439 (2013.01); H01L 21/324 (2013.01); H01L 21/3245 (2013.01);
Abstract

Implementations of the present disclosure generally relate to methods and apparatus for forming a film on a substrate. More particularly, implementations of the present disclosure relate to methods and apparatus for heteroepitaxial growth of crystalline films. In one implementation, a method of heteroepitaxial deposition of a strain relaxed buffer (SRB) layer on a substrate is provided. The method comprises epitaxially depositing a buffer layer over a dissimilar substrate, rapidly heating the buffer layer to relax the buffer layer, rapidly cooling the buffer layer and determining whether the buffer layer has achieved a desired thickness.


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