The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 13, 2016

Filed:

Sep. 12, 2013
Applicant:

Tokyo Electron Limited, Minato-ku, JP;

Inventors:

Miyako Kaneko, Nirasaki, JP;

Takehiko Orii, Nirasaki, JP;

Itaru Kanno, Minato-ku, JP;

Assignee:

TOKYO ELECTRON LIMITED, Minato-ku, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); B08B 3/04 (2006.01); H01L 21/67 (2006.01); H01L 21/687 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02052 (2013.01); H01L 21/0206 (2013.01); H01L 21/0209 (2013.01); H01L 21/02057 (2013.01); H01L 21/6715 (2013.01); H01L 21/67046 (2013.01); H01L 21/67051 (2013.01); H01L 21/67115 (2013.01); H01L 21/68728 (2013.01); B08B 3/04 (2013.01);
Abstract

A method for cleaning a substrate includes supplying a treatment solution which includes a volatile component onto the front surface of a substrate, solidifying or curing the treatment solution through vaporization of the volatile component of the treatment solution such that a treatment film is formed on the entire portion of the front surface of the substrate, treating a different surface of the substrate while the entire portion of the front surface of the substrate is covered with the treatment film, and supplying to the substrate a removal solution which removes the treatment film in the amount sufficient such that the treatment film covering the entire portion of the front surface of the substrate is removed substantially in entirety after the treating of the different surface of the substrate is finished.


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