The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 06, 2016

Filed:

Aug. 04, 2015
Applicant:

Kinsus Interconnect Technology Corp., Taoyuan, TW;

Inventors:

Ting-Hao Lin, Taipei, TW;

Chiao-Cheng Chang, Taoyuan, TW;

Yi-Nong Lin, Keelung, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 27/30 (2006.01); H01F 5/00 (2006.01); H01F 27/29 (2006.01); H05K 1/18 (2006.01); H05K 1/02 (2006.01); H01F 27/28 (2006.01);
U.S. Cl.
CPC ...
H05K 1/189 (2013.01); H01F 27/28 (2013.01); H05K 1/028 (2013.01); H05K 2201/1003 (2013.01);
Abstract

A carrier board structure includes at least one upper magnetic coil, at least one lower magnetic coil, a flexible board, a dielectric layer, at least one connection pad and at least one gold finger. The flexible board has a middle region having a middle hole, and two side regions thinner than the middle region. A groove used as a fold line is provided on the lower surface of each side region bordering on the middle region. The upper and lower magnetic coils are configured in the flexible board and separated by the dielectric layer. The gold fingers are provided on the two side regions and connected to the upper magnetic coils. The upper and lower magnetic coils are around the middle hole and connected by the connection pads. The fold lines help the two side regions to fold without damage to the upper and lower magnetic coils.


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