The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 06, 2016
Filed:
Nov. 28, 2012
Applicant:
Ibiden Co., Ltd., Ogaki-shi, JP;
Inventors:
Toshiki Furutani, Ogaki, JP;
Yukinobu Mikado, Ogaki, JP;
Toyotaka Shimabe, Ogaki, JP;
Shinobu Kato, Ogaki, JP;
Assignee:
IBIDEN CO., LTD., Ogaki-shi, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/18 (2006.01); H05K 3/10 (2006.01); H05K 3/30 (2006.01); H05K 1/11 (2006.01); H01L 23/00 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 1/186 (2013.01); H01L 24/19 (2013.01); H05K 1/0296 (2013.01); H05K 1/111 (2013.01); H05K 1/116 (2013.01); H05K 1/185 (2013.01); H05K 3/10 (2013.01); H05K 3/30 (2013.01); H05K 3/306 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73267 (2013.01); H01L 2224/92144 (2013.01); H01L 2924/15153 (2013.01); H05K 3/4697 (2013.01); H05K 2201/10636 (2013.01); Y02P 70/611 (2015.11); Y10T 29/49146 (2015.01);
Abstract
A wiring board includes a substrate which has multiple opening portions and one or more boundary portions separating the opening portions, multiple electronic devices positioned in the opening portions of the substrate, respectively, a conductive pattern formed on a surface of the boundary portion, and an insulation layer formed on the substrate and the conductive pattern on the boundary portion of the substrate such that the insulation layer covers the electronic devices in the opening portions of the substrate.