The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 06, 2016

Filed:

Nov. 06, 2015
Applicant:

Tessera, Inc., San Jose, CA (US);

Inventors:

Ilyas Mohammed, Santa Clara, CA (US);

Belgacem Haba, Saratoga, CA (US);

Cyprian Emeka Uzoh, San Jose, CA (US);

Piyush Savalia, San Jose, CA (US);

Vage Oganesian, Sunnyvale, CA (US);

Assignee:

Tessera, Inc., San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/64 (2006.01); H01L 21/00 (2006.01); H01G 4/06 (2006.01); H01L 21/768 (2006.01); H01L 23/48 (2006.01); H01L 49/02 (2006.01); H01L 23/498 (2006.01); H01L 25/16 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
H01L 23/642 (2013.01); H01G 4/06 (2013.01); H01L 21/76898 (2013.01); H01L 23/481 (2013.01); H01L 23/49822 (2013.01); H01L 23/49827 (2013.01); H01L 28/40 (2013.01); H01L 28/91 (2013.01); H01L 28/92 (2013.01); H01L 25/0657 (2013.01); H01L 25/16 (2013.01); H01L 2223/6622 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A capacitor can include a substrate having a first surface, a second surface remote from the first surface, and a through opening extending between the first and second surfaces, first and second metal elements, and a capacitor dielectric layer separating and insulating the first and second metal elements from one another at least within the through opening. The first metal element can be exposed at the first surface and can extend into the through opening. The second metal element can be exposed at the second surface and can extend into the through opening. The first and second metal elements can be electrically connectable to first and second electric potentials. The capacitor dielectric layer can have an undulating shape.


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