The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 30, 2016

Filed:

May. 05, 2015
Applicant:

Hgst Netherlands B.v., Amsterdam, NL;

Inventors:

Julia Cushen, Mountain View, CA (US);

Ricardo Ruiz, Santa Clara, CA (US);

Lei Wan, San Jose, CA (US);

Assignee:

HGST Netherlands B.V., Amsterdam, NL;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/3065 (2006.01); H01L 21/308 (2006.01); C03C 15/00 (2006.01); B82B 3/00 (2006.01); B82Y 40/00 (2011.01); H01J 37/32 (2006.01); B05D 3/14 (2006.01); H01L 21/027 (2006.01); B81C 1/00 (2006.01); G11B 5/855 (2006.01); G11B 5/84 (2006.01); H01L 21/311 (2006.01);
U.S. Cl.
CPC ...
H01J 37/32366 (2013.01); B05D 3/145 (2013.01); B82B 3/0014 (2013.01); B82Y 40/00 (2013.01); C03C 15/00 (2013.01); H01L 21/3065 (2013.01); H01L 21/3086 (2013.01); B81C 1/00396 (2013.01); G11B 5/8404 (2013.01); G11B 5/855 (2013.01); H01J 2237/3341 (2013.01); H01L 21/0271 (2013.01); H01L 21/0272 (2013.01); H01L 21/31138 (2013.01);
Abstract

A method that uses both electron beam (e-beam) lithography and directed self-assembly (DSA) of block copolymers (BCPs) makes guiding lines with oxidized sidewalls for use in subsequent DSA of BCPs. A series of films is deposited on a substrate including a first cross-linked polymer mat layer, a layer of resist, an etch stop layer resistant to oxygen reactive-ion-etching, a second cross-linked polymer mat layer, and an e-beam resist. After patterning and etching the second mat layer, a BCP self-assembles onto the patterned second mat layer and one of the BCP components is removed. Then the second mat layer is etched, using the remaining BCP component as an etch mask. Additional etching steps then create guiding lines of the first mat layer with oxidized sidewalls. The resulting guiding lines have better quality and lower roughness than guiding lines made with just e-beam lithography.


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