The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 23, 2016

Filed:

Nov. 21, 2014
Applicant:

Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;

Inventors:

Li-Chuan Tsai, Kaohsiung, TW;

Chih-Cheng Lee, Kaohsiung, TW;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/52 (2006.01); H05K 1/18 (2006.01); H01L 21/48 (2006.01); H01L 23/498 (2006.01); H05K 3/34 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/186 (2013.01); H01L 21/486 (2013.01); H01L 21/4857 (2013.01); H01L 23/49822 (2013.01); H01L 23/49827 (2013.01); H01L 23/49838 (2013.01); H05K 3/007 (2013.01); H05K 3/34 (2013.01); H05K 2203/06 (2013.01);
Abstract

The present disclosure relates to a semiconductor device substrate and a method for making the same. The semiconductor device substrate includes a first dielectric layer, a second dielectric layer and an electronic component. The first dielectric layer includes a body portion, and a wall portion protruded from a first surface of the body portion. The wall portion has an end. The second dielectric layer has a first surface and an opposing second surface. The first surface of the second dielectric layer is adjacent to the first surface of the body portion. The second dielectric layer surrounds the wall portion. The end of the wall portion extends beyond the second surface of the second dielectric layer. The electronic component includes a first electrical contact and a second electrical contact. At least a part of the electronic component is surrounded by the wall portion.


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