The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 23, 2016

Filed:

Jun. 24, 2013
Applicants:

Sumco Corporation, Tokyo, JP;

Sumco Techxiv Corporation, Nagasaki, JP;

Inventors:

Tadashi Kawashima, Nagasaki, JP;

Naoya Nonaka, Nagasaki, JP;

Masayuki Shinagawa, Nagasaki, JP;

Gou Uesono, Nagasaki, JP;

Assignees:

SUMCO CORPORATION, Tokyo, JP;

SUMCO TECHXIV CORPORATION, Nagasaki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C30B 25/10 (2006.01); H01L 29/167 (2006.01); H01L 21/322 (2006.01); H01L 29/02 (2006.01); H01L 21/02 (2006.01); H01L 29/06 (2006.01);
U.S. Cl.
CPC ...
H01L 29/167 (2013.01); H01L 21/0262 (2013.01); H01L 21/02381 (2013.01); H01L 21/02532 (2013.01); H01L 21/02576 (2013.01); H01L 21/02658 (2013.01); H01L 21/3221 (2013.01); H01L 29/02 (2013.01); H01L 29/0603 (2013.01);
Abstract

A method includes: a backside-oxidation-film-formation step in which an oxidation film is formed on a backside of a silicon wafer; a backside-oxidation-film-removal step in which the oxidation film provided at an outer periphery of the silicon wafer is removed; an argon-annealing step in which the silicon wafer after the backside-oxidation-film-removal step is subjected to a heat treatment in an argon gas atmosphere at a temperature in a range from 1200 to 1220 degrees C. for 60 minutes or more and 120 minutes or less; and an epitaxial-film-formation step in which an epitaxial film is formed on a surface of the silicon wafer after the argon-annealing step.


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