The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 23, 2016

Filed:

Dec. 19, 2013
Applicant:

Mitsubishi Electric Corporation, Chiyoda-ku, JP;

Inventors:

Yutaka Fukui, Tokyo, JP;

Yasuhiro Kagawa, Tokyo, JP;

Rina Tanaka, Tokyo, JP;

Yuji Abe, Tokyo, JP;

Masayuki Imaizumi, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/73 (2006.01); H01L 29/16 (2006.01); H01L 29/36 (2006.01); H01L 29/66 (2006.01); H01L 29/739 (2006.01); H01L 29/04 (2006.01); H01L 21/04 (2006.01); H01L 29/423 (2006.01); H01L 29/78 (2006.01); H01L 21/265 (2006.01); H01L 27/088 (2006.01); H01L 29/08 (2006.01); H01L 29/10 (2006.01); H01L 29/417 (2006.01);
U.S. Cl.
CPC ...
H01L 29/1608 (2013.01); H01L 21/046 (2013.01); H01L 21/049 (2013.01); H01L 21/0475 (2013.01); H01L 21/26586 (2013.01); H01L 27/088 (2013.01); H01L 29/045 (2013.01); H01L 29/0865 (2013.01); H01L 29/1095 (2013.01); H01L 29/36 (2013.01); H01L 29/41741 (2013.01); H01L 29/4236 (2013.01); H01L 29/66068 (2013.01); H01L 29/66348 (2013.01); H01L 29/66734 (2013.01); H01L 29/739 (2013.01); H01L 29/7397 (2013.01); H01L 29/78 (2013.01); H01L 29/7813 (2013.01); H01L 29/7827 (2013.01);
Abstract

A silicon carbide semiconductor device that reduces an influence of an off-angle of a silicon carbide substrate on characteristics of the semiconductor device and achieves improved operational stability and reduced resistance. In a trench-gate silicon carbide MOSFET semiconductor device, a high-concentration well region is formed in a well region, and a distance from a first sidewall surface of a trench of the silicon carbide semiconductor to the high-concentration well region is smaller than a distance from a second sidewall surface of the trench to the high-concentration well region, the second sidewall surface facing the first sidewall surface of the trench through the gate electrode.


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