The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 23, 2016

Filed:

Mar. 22, 2012
Applicants:

James S. Dunn, Jericho, VT (US);

Zhong-xiang He, Essex Junction, VT (US);

Anthony K. Stamper, Williston, VT (US);

Inventors:

James S. Dunn, Jericho, VT (US);

Zhong-Xiang He, Essex Junction, VT (US);

Anthony K. Stamper, Williston, VT (US);

Assignee:

GLOBALFOUNDRIES INC., Grand Cayman, KY;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01G 4/33 (2006.01); H01G 4/38 (2006.01); H01G 4/12 (2006.01); H01G 4/232 (2006.01); H01L 23/522 (2006.01); H01L 49/02 (2006.01); H01L 27/08 (2006.01);
U.S. Cl.
CPC ...
H01G 4/33 (2013.01); H01G 4/1209 (2013.01); H01G 4/232 (2013.01); H01G 4/38 (2013.01); H01L 23/5223 (2013.01); H01L 27/0805 (2013.01); H01L 28/40 (2013.01); H01L 28/60 (2013.01); H01L 2924/0002 (2013.01); Y10T 29/43 (2015.01); Y10T 29/435 (2015.01); Y10T 29/49156 (2015.01);
Abstract

A high density capacitor and low density capacitor simultaneously formed on a single wafer and a method of manufacture is provided. The method includes depositing a bottom plate on a dielectric material; depositing a low-k dielectric on the bottom plate; depositing a high-k dielectric on the low-k dielectric and the bottom plate; depositing a top plate on the high-k dielectric; and etching a portion of the bottom plate and the high-k dielectric to form a first metal-insulator-metal (MIM) capacitor having a dielectric stack with a first thickness and a second MIM capacitor having a dielectric stack with a second thickness different than the first thickness.


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