The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 16, 2016

Filed:

Dec. 22, 2014
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Yanqing Deng, North Potomac, MD (US);

Sungjae Lee, Schenectady, NY (US);

Edward J. Nowak, Essex Junction, VT (US);

Jin Z. Wallner, Albany, NY (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 27/02 (2006.01); H01L 27/08 (2006.01); H01L 49/02 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 27/0288 (2013.01); H01L 21/7684 (2013.01); H01L 21/7685 (2013.01); H01L 21/76877 (2013.01); H01L 27/0802 (2013.01); H01L 28/20 (2013.01);
Abstract

The integrated circuit described herein includes: a first resistor having a first trench in a dielectric layer, the first trench having a first width; a second resistor having a second trench in the dielectric layer, the second trench having a second width not equal to the first width; a trench in a dielectric layer, a first conductive layer having a first TCR and coating at least a portion of the first trench and the second trench; and a second conductive layer having a second TCR and coating at least a portion of the first conductive layer in each of the first trench and the second trench, wherein the second TCR is not equal to the first TCR, and wherein the TCR of the IC is selected based on a dimension of the trench, a thickness of the first conductive layer, and a thickness of the second conductive layer.


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