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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9418954 B1

PDFFull Text
Date of Patent:
Aug. 16, 2016

Filed:

Mar. 17, 2015

Integrated circuit chip assembled on an interposer

Applicants:

Stmicroelectronics SA, Montrouge, FR;

Stmicroelectronics (Crolles 2) Sas, Crolles, FR;

Inventors:

Pierre Bar, Grenoble, FR;

Alisee Taluy, Saint Martin d'heres, FR;

Olga Kokshagina, Paris, FR;

Assignees:

STMICROELECTRONICS SA, Montrouge, FR;

STMICROELECTRONICS (CROLLES 2) SAS, Crolles, FR;

Attorney:

Gardere Wynne Sewell LLP

Primary Examiner:

Alexander Oscar Williams

Int. Cl.
CPC ...
H01L 23/367 (2006.01); H01L 23/31 (2006.01); H01L 23/538 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 21/3213 (2006.01); H01L 21/56 (2006.01); H01L 21/768 (2006.01); H01L 23/36 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H01L 24/11 (2013.01); H01L 21/32139 (2013.01); H01L 21/4871 (2013.01); H01L 21/563 (2013.01); H01L 21/76897 (2013.01); H01L 23/3157 (2013.01); H01L 23/36 (2013.01); H01L 23/367 (2013.01); H01L 23/3677 (2013.01); H01L 23/49838 (2013.01); H01L 24/17 (2013.01); H01L 24/81 (2013.01); H01L 23/49827 (2013.01); H01L 2224/14519 (2013.01); H01L 2224/29147 (2013.01); H01L 2224/30519 (2013.01); H01L 2224/81192 (2013.01); H01L 2224/81801 (2013.01); H01L 2224/81815 (2013.01); H01L 2924/12042 (2013.01);
Abstract

A device includes a chip assembled on an interposer. An electrically-insulating layer coats an upper surface of the interposer around the chip. First metal lines run on the upper surface of the interposer and are arranged between conductive elements of connection to the chip. An end of each first metal line is arranged to extend beyond a projection of the chip on the interposer. A thermally-conductive via connects the end of the first metal line to a heat sink supported at an upper surface of the device.

Find Patent Forward Citations

Bar, Pierre. (2016). Integrated circuit chip assembled on an interposer (U.S. Patent No. 9418954). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9418954

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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