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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9418874 B1

PDFFull Text
Date of Patent:
Aug. 16, 2016

Filed:

May. 19, 2015

Method of fabricating semiconductor package

Applicant:

Siliconware Precision Industries Co., Ltd., Taichung, TW;

Inventors:

Wan-Ting Chen, Taichung, TW;

Mu-Hsuan Chan, Taichung, TW;

Yi-Chian Liao, Taichung, TW;

Chun-Tang Lin, Taichung, TW;

Yi-Che Lai, Taichung, TW;

Assignee:

Siliconware Precision Industries Co., Ltd., Taichung, TW;

Attorneys:

Mintz Levin Cohn Ferris Glovsky and Popeo, P.C.

Peter F. Corless

Steven M. Jensen

Primary Examiner:

Tu-Tu Ho

Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 21/56 (2006.01); H01L 23/28 (2006.01); H01L 23/538 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 21/78 (2006.01);
U.S. Cl.
CPC ...
H01L 21/561 (2013.01); H01L 21/56 (2013.01); H01L 21/563 (2013.01); H01L 21/565 (2013.01); H01L 21/78 (2013.01); H01L 23/28 (2013.01); H01L 23/31 (2013.01); H01L 23/49827 (2013.01); H01L 23/49833 (2013.01); H01L 23/5384 (2013.01); H01L 24/81 (2013.01); H01L 24/83 (2013.01); H01L 24/94 (2013.01); H01L 24/96 (2013.01); H01L 24/97 (2013.01); H01L 23/3121 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/06181 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/94 (2013.01); H01L 2224/97 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06541 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/157 (2013.01); H01L 2924/15788 (2013.01); H01L 2924/3511 (2013.01); H01L 2924/3512 (2013.01);
Abstract

A semiconductor package is provided, including: a carrier; at least an interposer disposed on the carrier; an encapsulant formed on the carrier for encapsulating the interposer while exposing a top side of the interposer; a semiconductor element disposed on the top side of the interposer; and an adhesive formed between the interposer and the semiconductor element. By encapsulating the interposer with the encapsulant, warpage of the interposer is avoided and a planar surface is provided for the semiconductor element to be disposed thereon, thereby improving the reliability of electrical connection between the interposer and the semiconductor element.

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