The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 16, 2016
Filed:
Jun. 06, 2011
Chun-ling Lin, Tainan, TW;
Yen-liang LU, Kaohsiung, TW;
Chi-mao Hsu, Tainan, TW;
Chin-fu Lin, Tainan, TW;
Chun-hung Chen, Tainan, TW;
Tsun-min Cheng, Changhua County, TW;
Chi-ray Tsai, Kaohsiung, TW;
Chun-Ling Lin, Tainan, TW;
Yen-Liang Lu, Kaohsiung, TW;
Chi-Mao Hsu, Tainan, TW;
Chin-Fu Lin, Tainan, TW;
Chun-Hung Chen, Tainan, TW;
Tsun-Min Cheng, Changhua County, TW;
Chi-Ray Tsai, Kaohsiung, TW;
UNITED MICROELECTRONICS CORP., Hsin-Chu, TW;
Abstract
An electrical chemical plating process is provided. A semiconductor structure is provided in an electrical plating platform. A pre-electrical-plating step is performed wherein the pre-electrical-plating step is carried out under a fixed voltage environment and lasts for 0.2 to 0.5 seconds after the current is above the threshold current of the electrical plating platform. After the pre-electrical-plating step, a first electrical plating step is performed on the semiconductor structure.