The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 09, 2016

Filed:

May. 19, 2014
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;

Inventors:

Ping-Lin Yang, Tianzhong Township, TW;

Jun-De Jin, Hsinchu, TW;

Fu-Lung Hsueh, Kaohsiung, TW;

Sa-Lly Liu, HsinChu, TW;

Tong-Chern Ong, Chong-Her, TW;

Chun-Jung Lin, HsinChu, TW;

Ya-Chen Kao, Fuxing Township, TW;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01F 5/00 (2006.01); H01L 25/065 (2006.01); H01F 27/28 (2006.01); H01F 41/04 (2006.01); H01L 23/522 (2006.01); H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); H01F 5/00 (2013.01); H01F 27/2804 (2013.01); H01F 41/046 (2013.01); H01L 23/48 (2013.01); H01L 23/5227 (2013.01); H01F 2027/2809 (2013.01); H01L 2225/06531 (2013.01); H01L 2924/0002 (2013.01); Y10T 29/4902 (2015.01);
Abstract

A communications structure comprises a first semiconductor substrate having a first coil, and a second semiconductor substrate having a second coil above the first semiconductor substrate. Inner edges of the first and second coils define a boundary of a volume that extends below the first coil and above the second coil. A ferromagnetic core is positioned at least partially within the boundary, such that a mutual inductance is provided between the first and second coils for wireless transmission of signals or power between the first and second coils.


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