The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 09, 2016
Filed:
Jun. 12, 2014
Applicant:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Inventor:
Ko-Feng Chen, Hsin-Chu, TW;
Assignee:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/66 (2006.01); H01L 21/308 (2006.01);
U.S. Cl.
CPC ...
H01L 22/20 (2013.01); H01L 21/3086 (2013.01); H01L 22/12 (2013.01);
Abstract
A method includes performing an etching on a mask layer to form an opening in the mask layer. The mask layer is a part of a wafer. The method further includes measuring a lateral size of the opening, comparing the lateral size of the opening with a specified range, and performing a compensation etch to compensate for a difference between the lateral size and the specified range. After the compensation etch, a target layer of the wafer is etched to extend the opening into the target layer.