The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 09, 2016
Filed:
Oct. 31, 2013
Dowa Metaltech Co., Ltd., Tokyo, JP;
Toshiya Kamada, Tokyo, JP;
Takashi Kimura, Tokyo, JP;
Weilin Gao, Tokyo, JP;
Fumiaki Sasaki, Tokyo, JP;
Akira Sugawara, Tokyo, JP;
DOWA METALTECH CO., LTD., Tokyo, JP;
Abstract
A Cu—Ni—Co—Si based copper alloy sheet material has second phase particles existing in a matrix, with a number density of ultrafine second phase particles is 1.0×10number/mmor more. A number density of fine second phase particles is not more than 5.0×10number/mm. A number density of coarse second phase particles is 1.0×10number/mmor more and not more than 1.0×10number/mm. The material has crystal orientation satisfying the following equation (1):{200}/{200}≧3.0  (1)wherein I{200} represents an integrated intensity of an X-ray diffraction peak of the {200} crystal plane on the sheet material sheet surface; and I{200} represents an integrated intensity of an X-ray diffraction peak of the {200} crystal plane in a pure copper standard powder sample.