The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 02, 2016
Filed:
May. 16, 2014
Taiwan Semiconductor Manufacturing Company Limited, Hsin-Chu, TW;
Yen-Hung Lin, Hsinchu, TW;
Chi Wei Hu, Pingzhen, TW;
Yuan-Te Hou, Hsinchu, TW;
Chung-Hsing Wang, Baoshan Township, TW;
Chin-Chou Liu, Jhubei, TW;
Taiwan Semiconductor Manufacturing Company Limited, Hsin-Chu, TW;
Abstract
A method of forming a semiconductor arrangement is provided. The semiconductor arrangement includes an interconnection arrangement comprising a first connection between a driver and a receiver. At least one buffer is disposed along the first connection to reduce delay associated with the interconnection arrangement. However, buffers increase power consumption, and thus a determination is made as to whether a buffer is unnecessary. A buffer is determined to be unnecessary where removal of the buffer does not violate a timing constraint regarding an amount of time a signal takes to go from the driver to the receiver. If a buffer is determined to be unnecessary, the buffer is removed to reduce power consumption.