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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9400428 B1

PDFFull Text
Date of Patent:
Jul. 26, 2016

Filed:

Jun. 20, 2014

Polymer compound, chemically amplified negative resist composition, photo-curable dry film and production method thereof, layered product, patterning process, and substrate

Applicant:

Shin-etsu Chemical Co., Ltd., Tokyo, JP;

Inventors:

Hiroyuki Urano, Jyoetsu, JP;

Masashi Iio, Jyoetsu, JP;

Katsuya Takemura, Jyoetsu, JP;

Takashi Miyazaki, Jyoetsu, JP;

Assignee:

SHIN-ETSU CHEMICAL CO., LTD., Tokyo, JP;

Attorney:

Oliff PLC

Primary Examiner:

Amanda C Walke

Int. Cl.
CPC ...
G03F 7/11 (2006.01); G03F 7/075 (2006.01); C08G 77/16 (2006.01); G03F 7/40 (2006.01); G03F 7/26 (2006.01); C08G 77/38 (2006.01); C08G 77/42 (2006.01); C08G 77/448 (2006.01); C08L 83/04 (2006.01); C08L 83/10 (2006.01); G03G 5/05 (2006.01); G03G 7/00 (2006.01); G03F 7/038 (2006.01);
U.S. Cl.
CPC ...
G03F 7/0757 (2013.01); C08G 77/16 (2013.01); C08G 77/38 (2013.01); C08G 77/42 (2013.01); C08G 77/448 (2013.01); C08L 83/04 (2013.01); C08L 83/10 (2013.01); G03F 7/038 (2013.01); G03F 7/0382 (2013.01); G03F 7/26 (2013.01); G03F 7/40 (2013.01); G03G 5/05 (2013.01); G03G 7/00 (2013.01); G03F 7/11 (2013.01);
Abstract

A polymer compound includes a carboxyl group and a siloxane chain and is obtained in the presence of an acid catalyst by condensation of at least; (I) a siloxane compound having phenol groups at both terminals, as shown by formula (1), (II) phenols shown by formula (2) and/or phenols shown by formula (3), and (III) one or more kinds of aldehydes and ketones shown by the following general formula (4). The polymer compound can be used suitably as a base resin of a chemically amplified negative resist composition with which the problem of delamination generated on metal wires, an electrode, and a substrate, can be improved, and with which a fine pattern can be formed without generating a scum and a footing profile in the pattern bottom and on the substrate, using a widely used aqueous 2.38% TMAH solution as a developer.

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