IDiyas

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9399822 B1

PDFFull Text
Date of Patent:
Jul. 26, 2016

Filed:

Jun. 24, 2014

Liquid compositions and methods of fabricating a semiconductor device using the same

Applicants:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Samyoung Pure Chemicals Co., Ltd., Seoul, KR;

Mitsubishi Gas Chemical Company, Inc., Tokyo, JP;

Inventors:

Dong-Min Kang, Seoul, KR;

Hyungjun Jeon, Seoul, KR;

Ingoo Kang, Yongin-si, KR;

Jeong Kwon, Ulsan, KR;

Jung-ig Jeon, Seoul, KR;

Jungsik Choi, Seongnam-si, KR;

Young Taek Hong, Hwaseong-si, KR;

Akira Hosomi, Tokyo, JP;

Tomoko Suzuki, Tokyo, JP;

Assignees:

Samsung Electronics Co., Ltd., , KR;

Samyoung Pure Chemicals Co., Ltd., , KR;

Mitsubishi Gas Chemical Company, Inc., , JP;

Attorney:

Myers Bigel & Sibley, P.A.

Primary Examiner:

Timor Karimy

Int. Cl.
CPC ...
H01L 21/44 (2006.01); C23F 1/18 (2006.01); H01L 21/3213 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
C23F 1/18 (2013.01); H01L 21/32134 (2013.01); H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 2224/0345 (2013.01); H01L 2224/03912 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05009 (2013.01); H01L 2224/05022 (2013.01); H01L 2224/0558 (2013.01); H01L 2224/05124 (2013.01); H01L 2224/05139 (2013.01); H01L 2224/05144 (2013.01); H01L 2224/05147 (2013.01); H01L 2224/05155 (2013.01); H01L 2224/05166 (2013.01); H01L 2224/05181 (2013.01); H01L 2224/05184 (2013.01); H01L 2224/05186 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/1147 (2013.01); H01L 2224/11462 (2013.01); H01L 2224/11849 (2013.01); H01L 2224/13082 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13155 (2013.01);
Abstract

The present inventive concepts provide a liquid composition for etching a metal containing copper. The liquid composition may include hydrogen peroxide in a range of about 0.1 wt % to about 10 wt % and a buffer solution in a range of about 0.1 wt % to about 10 wt %. The buffer solution may include citrate. The liquid composition may have a pH in a range of about 4.0 to about 7.0.

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