The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 19, 2016

Filed:

Feb. 26, 2015
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Cheng-Wei Cheng, White Plains, NY (US);

Pranita Kerber, Mount Kisco, NY (US);

Young-Hee Kim, Mohegan Lake, NY (US);

Effendi Leobandung, Stormville, NY (US);

Yanning Sun, Scarsdale, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/205 (2006.01); H01L 29/08 (2006.01); H01L 29/06 (2006.01); H01L 29/66 (2006.01); H01L 29/78 (2006.01); H01L 29/20 (2006.01); H01L 29/205 (2006.01); H01L 29/207 (2006.01); H01L 29/36 (2006.01); H01L 29/38 (2006.01); H01L 21/18 (2006.01); H01L 21/20 (2006.01);
U.S. Cl.
CPC ...
H01L 29/0847 (2013.01); H01L 29/0603 (2013.01); H01L 29/0843 (2013.01); H01L 29/66492 (2013.01); H01L 29/66636 (2013.01); H01L 29/7833 (2013.01);
Abstract

A method for fabricating a semiconductor device may include receiving a gated substrate comprising a substrate with a channel layer and a gate structure formed thereon, over-etching the channel layer to expose an extension region below the gate structure, epitaxially growing a halo layer on the exposed extension region using a first in-situ dopant and epitaxially growing a source or drain on the halo layer using a second in-situ dopant, wherein the first in-situ dopant and the second in-situ dopant are of opposite doping polarity. Using an opposite doping polarity may provide an energy band barrier for the semiconductor device and reduce leakage current. A corresponding apparatus is also disclosed herein.


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