The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 19, 2016

Filed:

May. 09, 2012
Applicants:

Maud Vinet, Rives sur Fure, FR;

Nicolas Loubet, Guilderland, NY (US);

Romain Wacquez, Marseilles, FR;

Inventors:

Maud Vinet, Rives sur Fure, FR;

Nicolas Loubet, Guilderland, NY (US);

Romain Wacquez, Marseilles, FR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 21/762 (2006.01); H01L 21/311 (2006.01); H01L 29/04 (2006.01); H01L 29/06 (2006.01); H01L 21/8234 (2006.01); H01L 21/3065 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76224 (2013.01); H01L 21/3065 (2013.01); H01L 21/31116 (2013.01); H01L 21/76232 (2013.01); H01L 21/76283 (2013.01); H01L 21/823481 (2013.01); H01L 29/04 (2013.01); H01L 29/045 (2013.01); H01L 29/0653 (2013.01);
Abstract

A method of producing a microelectronic device in a substrate including a first semiconductor layer, a dielectric layer and a second monocrystalline semiconductor layer, the method including: etching a trench through the first semiconductor layer and the dielectric layer, and such that the trench delimits one active region of the microelectronic device; chemical vapor etching the second semiconductor layer, at a level of a bottom wall of the trench, according to at least two crystalline planes of the second semiconductor layer such that an etched part of the second semiconductor layer extends under a part of the active region; filling the trench and the etched part of the second semiconductor layer with a dielectric material.


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