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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9392643 B1

PDFFull Text
Date of Patent:
Jul. 12, 2016

Filed:

Oct. 24, 2013

Heating plate with planar heater zones for semiconductor processing

Applicant:

Lam Research Corporation, Fremont, CA (US);

Inventors:

Harmeet Singh, Fremont, CA (US);

Keith Gaff, Fremont, CA (US);

Neil Benjamin, East Palo Alto, CA (US);

Keith Comendant, Fremont, CA (US);

Assignee:

LAM RESEARCH CORPORATION, Fremont, CA (US);

Attorney:

Buchanan Ingersoll & Rooney PC

Primary Examiner:

Joseph M Pelham

Int. Cl.
CPC ...
H01L 21/68 (2006.01); H01L 23/28 (2006.01); H01L 23/52 (2006.01); F27B 5/14 (2006.01); F27D 11/02 (2006.01); H05B 3/00 (2006.01); C23C 14/54 (2006.01); C23C 16/458 (2006.01); H01L 21/67 (2006.01); H01L 21/3065 (2006.01); H05B 1/02 (2006.01); H05B 3/26 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
H05B 3/00 (2013.01); C23C 14/541 (2013.01); C23C 16/4586 (2013.01); H01L 21/3065 (2013.01); H01L 21/67103 (2013.01); H01L 21/67248 (2013.01); H05B 1/0233 (2013.01); H05B 3/26 (2013.01); H01L 21/67109 (2013.01); H01L 21/6831 (2013.01); Y10T 29/49083 (2015.01); Y10T 29/49099 (2015.01);
Abstract

An exemplary method for manufacturing a heating plate for a substrate support assembly includes forming holes in at least one sheet, printing a slurry of conductor powder, or pressing a precut metal foil, or spraying a slurry of conductor powder, on the at least one sheet to form the planar heater zones, the power supply lines, and power return lines. The holes in the at least one sheet are filled with a slurry of conductor powder to form power supply and power return vias. The sheets are then aligned, pressed, and bonded to form the heating plate.

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