The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 12, 2016

Filed:

Dec. 03, 2012
Applicant:

Wuxi China Resources Huajing Microelectronics Co., Ltd., Wuxi, Jiangsu, CN;

Inventors:

Hongxiang Tang, Jiangsu, CN;

Yongsheng Sun, Jiangsu, CN;

Jianxin Ji, Jiangsu, CN;

Weiqing Ma, Jiangsu, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/739 (2006.01); H01L 29/66 (2006.01); H01L 29/08 (2006.01); H01L 21/02 (2006.01); H01L 29/10 (2006.01);
U.S. Cl.
CPC ...
H01L 29/7397 (2013.01); H01L 21/02499 (2013.01); H01L 21/02634 (2013.01); H01L 29/0821 (2013.01); H01L 29/0834 (2013.01); H01L 29/1095 (2013.01); H01L 29/66333 (2013.01); H01L 29/66348 (2013.01); H01L 29/7395 (2013.01);
Abstract

A Trench Insulated Gate Bipolar Transistor (IGBT) and a manufacture method thereof are provided by the present invention, which belongs to the field of IGBT technical field. The manufacture method includes following steps: (1) preparing a semiconductor substrate; (2) forming an epitaxial layer grow on a first side of the semiconductor substrate by epitaxial growth; (3) preparing and forming a gate and an emitter of the Trench Insulated Gate Bipolar Transistor on a second side of the semiconductor substrate; (4) thinning the epitaxial layer to form a collector region; (5) metalizing the collector region to form a collector. The cost of the manufacture method is low and the performance of the Trench IGBT formed by the manufacture method is good.


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