The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 12, 2016
Filed:
Jan. 22, 2015
Applicant:
Tokyo Electron Limited, Tokyo, JP;
Inventors:
Hideomi Hane, Iwate, JP;
Takahito Umehara, Iwate, JP;
Assignee:
TOKYO ELECTRON LIMITED, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/31 (2006.01); C23C 16/458 (2006.01); H01L 21/02 (2006.01); C23C 16/448 (2006.01); C23C 16/44 (2006.01); C23C 16/455 (2006.01); H01L 21/677 (2006.01); H01L 21/687 (2006.01);
U.S. Cl.
CPC ...
C23C 16/4584 (2013.01); C23C 16/4401 (2013.01); C23C 16/448 (2013.01); C23C 16/45519 (2013.01); C23C 16/45551 (2013.01); H01L 21/02164 (2013.01); H01L 21/02271 (2013.01); H01L 21/67748 (2013.01); H01L 21/68764 (2013.01); H01L 21/68771 (2013.01);
Abstract
A method for processing a substrate using a substrate processing apparatus is provided. The substrate processing apparatus includes a process chamber and a rotatable turntable having a substrate receiving part provided in the process chamber. In the method, a substrate is placed on a substrate receiving part, and the substrate is processed by supplying process gases into the process chamber. At least a water vapor is supplied into the chamber when the substrate is placed on the substrate receiving part. After that, the substrate is carried out of the process chamber.