The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 05, 2016

Filed:

Dec. 08, 2014
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Gaurav Chawla, San Jose, CA (US);

Joshua D Heppner, Chandler, AZ (US);

Zhichao Zhang, Chandler, AZ (US);

David J. Llapitan, Tacoma, WA (US);

Vijaykumar Krithivasan, Chandler, AZ (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 24/28 (2011.01); H01R 12/72 (2011.01); H01R 12/79 (2011.01); H01R 13/11 (2006.01); H01R 12/71 (2011.01); H01L 23/34 (2006.01); H01R 12/70 (2011.01);
U.S. Cl.
CPC ...
H01R 12/722 (2013.01); H01L 23/34 (2013.01); H01R 12/7005 (2013.01); H01R 12/71 (2013.01); H01R 12/724 (2013.01); H01R 12/79 (2013.01); H01R 13/114 (2013.01);
Abstract

Connectors and methods to couple packages and dies are shown. Selected examples include plugs and receptacles having two or more terraces with contacts provided along the terraces. Examples of connectors and methods include configurations where the connector is usable with a package including a die coupled along a substrate. In selected examples a heat sink is coupled over the die, and a package includes a side access port between the heat sink and the substrate configured to receive the connector, such as one or more of a plug or receptacle through the side access port.


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