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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9385236 B1

PDFFull Text
Date of Patent:
Jul. 05, 2016

Filed:

Jun. 24, 2015

Fin shaped semiconductor device structures having tipped end shape and method for fabricating the same

Applicant:

United Microelectronics Corp., Hsin-Chu, TW;

Inventors:

Chien-Ying Sun, Tainan, TW;

En-Chiuan Liou, Tainan, TW;

Ming-Shing Chen, Tainan, TW;

Yu-Cheng Tung, Kaohsiung, TW;

Chih-Wei Yang, Kaohsiung, TW;

Assignee:

UNITED MICROELECTRONICS CORP., Science-Based Industrial Park, Hsin-Chu, TW;

Attorneys:

Winston Hsu

Scott Margo

Primary Examiner:

Thomas L Dickey

Assistant Examiner:

Changhyun Yi

Int. Cl.
CPC ...
H01L 21/28 (2006.01); H01L 29/66 (2006.01); H01L 29/78 (2006.01); H01L 29/06 (2006.01); H01L 21/8234 (2006.01); H01L 27/088 (2006.01); G06F 17/50 (2006.01);
U.S. Cl.
CPC ...
H01L 29/7853 (2013.01); G06F 17/5081 (2013.01); H01L 21/823412 (2013.01); H01L 21/823431 (2013.01); H01L 21/823456 (2013.01); H01L 21/823481 (2013.01); H01L 27/0886 (2013.01); H01L 29/0653 (2013.01); H01L 29/66545 (2013.01); H01L 29/7856 (2013.01);
Abstract

A semiconductor device and a method of forming the same, the semiconductor device includes a plurality of fin shaped structures and a dummy gate structure. The fin shaped structures are disposed in a substrate, where at least one of the fin shaped structures has a tipped end. The dummy gate structure is disposed on the substrate, and includes an extending portion covering the tipped end.

Find Patent Forward Citations

Sun, Chien-Ying. (2016). Fin shaped semiconductor device structures having tipped end shape and method for fabricating the same (U.S. Patent No. 9385236). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9385236

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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