The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 28, 2016
Filed:
May. 19, 2014
Applicants:
Konstantine Karavakis, Pleasanton, CA (US);
Kenneth S. Bahl, Saratoga, CA (US);
Steve Carney, San Jose, CA (US);
Inventors:
Konstantine Karavakis, Pleasanton, CA (US);
Kenneth S. Bahl, Saratoga, CA (US);
Steve Carney, San Jose, CA (US);
Assignee:
Sierra Circuits, Inc., Sunnyvale, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/02 (2006.01); H05K 3/10 (2006.01); H05K 1/03 (2006.01); H05K 1/09 (2006.01); H05K 1/11 (2006.01); H05K 3/08 (2006.01); H05K 3/40 (2006.01); H05K 3/18 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0306 (2013.01); H05K 1/09 (2013.01); H05K 1/115 (2013.01); H05K 3/08 (2013.01); H05K 3/185 (2013.01); H05K 3/4038 (2013.01); H05K 3/0041 (2013.01); H05K 3/107 (2013.01); H05K 2201/017 (2013.01); H05K 2201/0236 (2013.01); H05K 2201/0376 (2013.01); H05K 2203/025 (2013.01); H05K 2203/0716 (2013.01); H05K 2203/107 (2013.01);
Abstract
A printed circuit board includes a laminate substrate. The laminate substrate includes catalytic material that resists metal plating except where a surface of the catalytic material is ablated. Metal traces are formed within in trace channels within the laminate substrate. The channels extend below the surface of the catalytic material.