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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9379090 B1

PDFFull Text
Date of Patent:
Jun. 28, 2016

Filed:

Feb. 13, 2015

System, apparatus, and method for split die interconnection

Applicant:

Qualcomm Incorporated, San Diego, CA (US);

Inventors:

Ahmer Raza Syed, Chandler, AZ (US);

Chin-Kwan Kim, San Diego, CA (US);

Omar James Bchir, San Marcos, CA (US);

Milind Pravin Shah, San Diego, CA (US);

Ryan David Lane, San Diego, CA (US);

Assignee:

QUALCOMM INCORPORATED, San Diego, CA (US);

Attorney:

Muncy, Geissler, Olds & Lowe, P.C.

Primary Examiner:

Elias M Ullah

Int. Cl.
CPC ...
H01L 23/34 (2006.01); H01L 25/065 (2006.01); H01L 23/538 (2006.01); H01L 23/367 (2006.01); H01L 23/00 (2006.01); H01L 21/683 (2006.01); H01L 25/00 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0655 (2013.01); H01L 21/6835 (2013.01); H01L 23/3675 (2013.01); H01L 23/5381 (2013.01); H01L 23/5385 (2013.01); H01L 23/5386 (2013.01); H01L 24/32 (2013.01); H01L 25/50 (2013.01); H01L 2224/32225 (2013.01);
Abstract

A semiconductor package for a side by side die configuration may include a substrate having a cavity, a bridge interposer positioned within the cavity and having an active side facing active sides of a first die and a second die and partially horizontally overlapping the first die and the second die to provide an interconnection between the first die and the second die, and a thermal element attached to backsides of the first die and the second die to provide a heat path and heat storage for the first die and the second die.

Find Patent Forward Citations

Syed, Ahmer. (2016). System, apparatus, and method for split die interconnection (U.S. Patent No. 9379090). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9379090

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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