The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 28, 2016
Filed:
Oct. 01, 2014
Taiwan Semiconductor Manufacturing Company Ltd., Hsinchu, TW;
Chen-Chih Hsieh, Miaoli County, TW;
Hao-Yi Tsai, Hsinchu, TW;
Chao-Wen Shih, Hsinchu County, TW;
Yung-Ping Chiang, Hsinchu County, TW;
Tsung-Yuan Yu, Taipei, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD., Hsinchu, TW;
Abstract
A method of manufacturing a semiconductor structure includes receiving a substrate including a die pad disposed thereon; disposing a passivation over the substrate and around the die pad; disposing a polymer over the passivation; forming a post passivation interconnect (PPI) including an elongated portion and a via portion contacting with the die pad; depositing a metallic paste on the elongated portion of the PPI by a stencil; disposing a conductive bump over the metallic paste; and disposing a molding over the PPI and around the metallic paste and the conductive bump.