The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 21, 2016

Filed:

Nov. 11, 2015
Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Inventors:

Marie Denison, Plano, TX (US);

Brian Ashley Carpenter, Cary, NC (US);

Osvaldo Jorge Lopez, Annandale, NJ (US);

Juan Alejandro Herbsommer, Allen, TX (US);

Jonathan Noquil, Bethlehem, PA (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/18 (2006.01); H01L 23/495 (2006.01); H01L 23/00 (2006.01); H01L 21/50 (2006.01); H01L 25/065 (2006.01); H01L 25/07 (2006.01); H01L 25/16 (2006.01); H01L 25/00 (2006.01); H01L 21/56 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49575 (2013.01); H01L 21/50 (2013.01); H01L 21/561 (2013.01); H01L 23/49524 (2013.01); H01L 23/49562 (2013.01); H01L 24/34 (2013.01); H01L 24/36 (2013.01); H01L 24/40 (2013.01); H01L 24/84 (2013.01); H01L 25/0657 (2013.01); H01L 25/072 (2013.01); H01L 25/16 (2013.01); H01L 25/18 (2013.01); H01L 25/50 (2013.01); H01L 23/49838 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/40137 (2013.01); H01L 2224/40139 (2013.01); H01L 2224/40145 (2013.01); H01L 2224/40245 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48247 (2013.01); H01L 2924/1301 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/1306 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/15747 (2013.01); H01L 2924/181 (2013.01);
Abstract

An electronic multi-output device has a substrate including a first pad, a second pad and a plurality of pins. A first chip with a first transistor has a first terminal on one chip surface and a second and third terminals on the opposite chip surface. The first chip with its first terminal is tied to the first pad. A second chip with a second transistor has a first terminal on one chip surface and a second and third terminals on the opposite chip surface. The second chip with its first terminal is tied to the second pad. The second terminals are connected by a discrete first metal clip and a second metal clip to respective substrate pins. A composite third chip has a third and a fourth transistor integrated so that the first terminals of the transistors are on one chip surface. The second terminals are merged into a common terminal. The patterned third terminals are on the opposite chip surface. The first terminals are vertically attached to the first and second metal clips, respectively. The common terminal is connected by a common clip to a substrate pin.


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