The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 21, 2016

Filed:

Jan. 23, 2015
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Shota Yoshimura, Miyagi, JP;

Eiji Suzuki, Miyagi, JP;

Tomiko Kamada, Miyagi, JP;

Hiroto Ohtake, Miyagi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/302 (2006.01); H01L 21/311 (2006.01); H01L 21/027 (2006.01); H01L 21/3213 (2006.01); H01L 21/67 (2006.01); H01L 27/115 (2006.01); H01J 37/32 (2006.01);
U.S. Cl.
CPC ...
H01L 21/311 (2013.01); H01J 37/3222 (2013.01); H01J 37/32449 (2013.01); H01L 21/0273 (2013.01); H01L 21/31116 (2013.01); H01L 21/31138 (2013.01); H01L 21/31144 (2013.01); H01L 21/32137 (2013.01); H01L 21/67069 (2013.01); H01J 37/32192 (2013.01); H01J 2237/327 (2013.01); H01J 2237/334 (2013.01); H01L 27/11524 (2013.01);
Abstract

In one embodiment of the present invention, there is provided a method for etching a multilayer film formed by laminating a plurality of alternating layers of a first layer having a first dielectric constant and a second layer having a second dielectric constant. This method includes (a) a multilayer film etching step, in which an etchant gas is supplied into a processing chamber and a microwave is supplied into the processing chamber to excite a plasma of the etchant gas; and (b) a resist mask reducing step in which an oxygen-containing gas and a fluorocarbon-based gas are supplied to the processing chamber and a microwave is supplied into the processing chamber to excite a plasma of the oxygen-containing gas and the fluorocarbon-based gas. In this method, the steps (a) and (b) are alternately repeated.


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