The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 21, 2016
Filed:
Oct. 22, 2014
Applicant:
Kla-tencor Corporation, Milpitas, CA (US);
Inventors:
Amir Azordegan, Santa Clara, CA (US);
Pradeep Vukkadala, Fremont, CA (US);
Craig MacNaughton, Los Gatos, CA (US);
Jaydeep Sinha, Livermore, CA (US);
Assignee:
KLA-Tencor Corporation, Milpitas, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 17/50 (2006.01); G06T 7/00 (2006.01); G01B 11/24 (2006.01); G01N 21/95 (2006.01);
U.S. Cl.
CPC ...
G06T 7/0006 (2013.01); G01B 11/24 (2013.01); G01N 21/9501 (2013.01); G06F 17/5081 (2013.01); G06T 2207/30148 (2013.01);
Abstract
Methods and systems enabling ultra-high resolution topography measurements of patterned wafers are disclosed. Measurements obtained utilizing the ultra-high resolution metrology may be utilized to improve wafer metrology measurement accuracies. Additionally, measurements obtained utilizing the ultra-high resolution metrology may also be utilized to provide feedback and/or calibration control to improve fabrication and design of wafers.