The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 14, 2016

Filed:

May. 27, 2015
Applicants:

Semiconductor Manufacturing International (Beijing) Corporation, Beijing, CN;

Semiconductor Manufacturing International (Shanghai) Corporation, Shanghai, CN;

Inventors:

Yunchu Yu, Shanghai, CN;

Yihua Shen, Shanghai, CN;

Fenghua Fu, Shanghai, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/8238 (2006.01); H01L 21/033 (2006.01); H01L 21/285 (2006.01);
U.S. Cl.
CPC ...
H01L 21/823814 (2013.01); H01L 21/0337 (2013.01); H01L 21/28518 (2013.01); H01L 21/823821 (2013.01); H01L 21/823871 (2013.01);
Abstract

A method for manufacturing one or more semiconductor devices may include the following steps: providing a dielectric layer on a substrate structure that includes a first electrode and a second electrode; providing a first mask on the dielectric layer; providing a second mask, which overlaps the first mask and has a designated structure, wherein a portion of the first mask is positioned between a first portion and a second portion of the designated structure in a layout view of a process structure that includes the first mask and the second mask; and performing a removal process through the first portion of the designated structure and through the second portion of the designated structure to form a first contact hole and a second contact hole in a remaining portion of the dielectric layer, wherein the two contact holes expose the two electrodes, respectively.


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