The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 07, 2016
Filed:
Jun. 11, 2015
Applicant:
Infineon Technologies Ag, Neubiberg, DE;
Inventors:
Johann Gatterbauer, Parsberg, DE;
Bernhard Weidgans, Bernhardswald, DE;
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/00 (2006.01); H01L 23/14 (2006.01); H01L 23/498 (2006.01); H01L 23/532 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49575 (2013.01); H01L 23/147 (2013.01); H01L 23/49524 (2013.01); H01L 23/49551 (2013.01); H01L 23/49562 (2013.01); H01L 23/49822 (2013.01); H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 24/34 (2013.01); H01L 24/36 (2013.01); H01L 24/40 (2013.01); H01L 24/42 (2013.01); H01L 23/53238 (2013.01); H01L 23/53252 (2013.01); H01L 2224/056 (2013.01); H01L 2224/05556 (2013.01); H01L 2224/05624 (2013.01); H01L 2224/40095 (2013.01); H01L 2224/40245 (2013.01); H01L 2224/85399 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/12032 (2013.01); H01L 2924/1301 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/181 (2013.01);
Abstract
In one embodiment, a device includes a first conductive pad disposed over a substrate, and a etch stop layer disposed over a top surface of the first conductive pad. The device further includes a solder barrier disposed over the etch stop layer.