The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 07, 2016

Filed:

Jan. 29, 2015
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Zongbin Wang, Singapore, SG;

Shalina Deepa Sudheeran, Singapore, SG;

Arvind Sundarrajan, San Jose, CA (US);

Bharat Bhushan, Singapore, SG;

Assignee:

APPLIED MATERIALS, INC., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01); H01L 21/4763 (2006.01); H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01); H01L 21/02 (2006.01); H01L 21/768 (2006.01); H01L 21/306 (2006.01); C23C 16/04 (2006.01); C23C 16/40 (2006.01); C23C 16/455 (2006.01); H01J 37/32 (2006.01); H01L 21/3065 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02274 (2013.01); C23C 16/045 (2013.01); C23C 16/402 (2013.01); C23C 16/4554 (2013.01); H01J 37/32357 (2013.01); H01J 37/32449 (2013.01); H01J 37/32568 (2013.01); H01J 37/32577 (2013.01); H01L 21/0228 (2013.01); H01L 21/02164 (2013.01); H01L 21/02205 (2013.01); H01L 21/02211 (2013.01); H01L 21/02216 (2013.01); H01L 21/30625 (2013.01); H01L 21/76831 (2013.01); H01L 21/76834 (2013.01); H01L 21/76877 (2013.01); H01L 21/76898 (2013.01); H01L 21/3065 (2013.01);
Abstract

Implementations described herein generally relate to methods for forming dielectric films in high aspect ratio features. In one implementation, a method for forming a silicon oxide layer is provided. A silicon-containing precursor gas is flown into a processing chamber having a substrate having a high aspect ratio feature disposed therein. Then a high frequency plasma is applied to the silicon-containing precursor gas to deposit a silicon-containing layer over the surface of the high aspect ratio feature. The processing chamber is purged to remove by-products from the silicon-containing layer deposition process. An oxygen-containing precursor gas is flown into the processing chamber. A high frequency plasma and a low frequency plasma are applied to the oxygen-containing precursor gas to form the silicon oxide layer.


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