The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 31, 2016

Filed:

Feb. 10, 2015
Applicant:

Silicon Genesis Corporation, San Jose, CA (US);

Inventors:

Francois Henley, Aptos, CA (US);

Al Lamm, Suisun City, CA (US);

Yi-Lei Chow, Los Altos, CA (US);

Assignee:

SILICON GENESIS CORPORATION, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/30 (2006.01); H01L 31/18 (2006.01); H01L 21/683 (2006.01); H01L 21/67 (2006.01); H01L 21/762 (2006.01); H01L 31/0392 (2006.01); H01L 31/068 (2012.01); H01L 31/0687 (2012.01); B26F 3/00 (2006.01); H01L 21/78 (2006.01); H01L 21/304 (2006.01);
U.S. Cl.
CPC ...
H01L 31/18 (2013.01); B26F 3/002 (2013.01); H01L 21/67092 (2013.01); H01L 21/683 (2013.01); H01L 21/76254 (2013.01); H01L 31/03921 (2013.01); H01L 31/068 (2013.01); H01L 31/0687 (2013.01); H01L 31/1804 (2013.01); H01L 31/1892 (2013.01); H01L 21/304 (2013.01); H01L 21/7813 (2013.01); Y02E 10/544 (2013.01); Y02E 10/547 (2013.01); Y02P 70/521 (2015.11); Y10T 225/10 (2015.04); Y10T 225/30 (2015.04); Y10T 225/393 (2015.04);
Abstract

A thickness of material may be detached from a substrate along a cleave plane, utilizing a cleaving process controlled by a releasable constraint plate. In some embodiments this constraint plate may comprise a plate that can couple side forces (the 'P-plate') and a thin, softer compliant layer (the 'S-layer') situated between the P-plate and the substrate. In certain embodiments a porous surface within the releasable constraint plate and in contact to the substrate, allows the constraint plate to be secured to the substrate via a first pressure differential. Application of a combination of a second pressure differential within a pre-existing cleaved portion, and a linear force to a side of the releasable constraint plate bound to the substrate, generates loading that results in controlled cleaving along the cleave plane.


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