The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 31, 2016
Filed:
Jun. 18, 2014
Tel Nexx, Inc., Billerica, MA (US);
Tel Epion Inc., Billerica, MA (US);
Georgiy Seryogin, Watertown, MA (US);
Thomas G. Tetreault, Manchester, NH (US);
Stephen N. Golovato, Lexington, MA (US);
Ramya Chandrasekaran, Acton, MA (US);
TEL NEXX, INC., Billerica, MA (US);
TEL EPION INC., Billerica, MA (US);
Abstract
Techniques disclosed herein a method and system for conditioning a polymeric layer on a substrate to enable adhesion of a metal layer to the polymeric layer. Techniques may include conditioning the polymeric layer with nitrogen-containing plasma to generate a nitride layer on the surface of the polymeric layer. In another embodiment, the conditioning may include depositing a CuN layer using a lower power copper sputtering process in a nitrogen rich environment. Following the condition process, a higher power copper deposition or sputtering process may be used to deposit copper onto the polymeric layer with good adhesion properties.