The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 24, 2016
Filed:
Jul. 28, 2014
Applicant:
Napra Co., Ltd., Tokyo, JP;
Inventors:
Shigenobu Sekine, Tokyo, JP;
Yurina Sekine, Tokyo, JP;
Assignee:
NAPRA CO., LTD., Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/00 (2006.01); H01L 27/04 (2006.01); H01L 27/06 (2006.01); H01L 21/02 (2006.01); H01L 49/02 (2006.01);
U.S. Cl.
CPC ...
H01L 27/04 (2013.01); H01L 21/02211 (2013.01); H01L 27/0676 (2013.01); H01L 28/90 (2013.01); H01L 2924/0002 (2013.01);
Abstract
An integrated circuit device includes a semiconductor substrate, an active element and a passive element. The active element is made of the semiconductor substrate. The passive element includes a functional element filled in a groove or hole provided in the semiconductor substrate along a thickness direction thereof and is electrically connected to the active element. The functional element has a Si—O bond region obtained by reacting Si particles with an organic Si compound.