The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 17, 2016

Filed:

Apr. 04, 2014
Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Inventors:

Jeffrey A. Babcock, Sunnyvale, CA (US);

Alexei Sadovnikov, Sunnyvale, CA (US);

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/8238 (2006.01); H01L 27/082 (2006.01); H01L 29/06 (2006.01); H01L 29/04 (2006.01); H01L 29/16 (2006.01); H01L 21/265 (2006.01); H01L 21/266 (2006.01); H01L 21/762 (2006.01); H01L 21/306 (2006.01); H01L 21/308 (2006.01); H01L 29/08 (2006.01); H01L 21/8228 (2006.01);
U.S. Cl.
CPC ...
H01L 27/082 (2013.01); H01L 21/266 (2013.01); H01L 21/26513 (2013.01); H01L 21/308 (2013.01); H01L 21/30604 (2013.01); H01L 21/76224 (2013.01); H01L 21/8228 (2013.01); H01L 29/04 (2013.01); H01L 29/063 (2013.01); H01L 29/0649 (2013.01); H01L 29/0808 (2013.01); H01L 29/0821 (2013.01); H01L 29/16 (2013.01);
Abstract

Complementary high-voltage bipolar transistors formed in standard bulk silicon integrated circuits are disclosed. In one disclosed embodiment, collector regions are formed in an epitaxial silicon layer. Base regions and emitters are disposed over the collector region. An n-type region is formed under collector region by implanting donor impurities into a p-substrate for the PNP transistor and implanting acceptor impurities into the p-substrate for the NPN transistor prior to depositing the collector epitaxial regions. Later in the process flow these n-type and p-type regions are connected to the top of the die by a deep n+ and p+ wells respectively. The n-type well is then coupled to VCC while the p-type well is coupled to GND, providing laterally depleted portions of the PNP and NPN collector regions and hence, increasing their BVs.


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