The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 17, 2016

Filed:

Jul. 03, 2013
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Brian Saxton Underwood, Santa Clara, CA (US);

Abhijit Basu Mallick, Palo Alto, CA (US);

Nitin K. Ingle, San Jose, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); C23C 16/40 (2006.01); C23C 16/452 (2006.01); C23C 16/455 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02216 (2013.01); C23C 16/401 (2013.01); C23C 16/452 (2013.01); C23C 16/45565 (2013.01); C23C 16/45574 (2013.01); H01L 21/02126 (2013.01); H01L 21/02274 (2013.01);
Abstract

Methods are described for forming a dielectric layer on a patterned substrate. The methods may include combining a silicon-and-carbon-containing precursor and a radical oxygen precursor in a plasma free substrate processing region within a chemical vapor deposition chamber. The silicon-and-carbon-containing precursor and the radical oxygen precursor react to deposit a flowable silicon-carbon-oxygen layer on the patterned substrate. The resulting film possesses a low wet etch rate ratio relative to thermal silicon oxide and other standard dielectrics.


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