The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 17, 2016

Filed:

Oct. 24, 2011
Applicants:

Kohei Yamaguchi, Hitachinaka, JP;

Takehiro Hirai, Ushiku, JP;

Fumihiko Fukunaga, Mito, JP;

Inventors:

Kohei Yamaguchi, Hitachinaka, JP;

Takehiro Hirai, Ushiku, JP;

Fumihiko Fukunaga, Mito, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H04N 9/47 (2006.01); H04N 7/18 (2006.01); G06T 7/00 (2006.01); H01J 37/22 (2006.01); H01J 37/28 (2006.01);
U.S. Cl.
CPC ...
G06T 7/0002 (2013.01); G06T 7/001 (2013.01); H01J 37/222 (2013.01); H01J 37/28 (2013.01); G06T 2200/24 (2013.01); G06T 2207/30148 (2013.01); H01J 2237/221 (2013.01); H01J 2237/24578 (2013.01); H01J 2237/24592 (2013.01); H01J 2237/2817 (2013.01);
Abstract

For inspection of a pattern such as a semiconductor device, it is useful to selectively detect a defect on the specific pattern in order to estimate the cause of the occurrence of the defect. An object of the invention is to provide a charged particle beam apparatus capable of setting, on the basis of the shape of the pattern on a sample, a region to be inspected. The invention is characterized in that the contour of the pattern on the sample is extracted using a template image obtained on the basis of an image of the sample, the region to be inspected is set on the basis of the contour of the pattern, a defect candidate is detected by comparing the image to be inspected with a comparative image, and the sample is inspected using a positional relationship between the region to be inspected and the defect candidate included in the region to be inspected.


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