The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 17, 2016
Filed:
Mar. 15, 2013
Applicant:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Inventors:
Tang-Kuei Chang, Tainan, TW;
Kuo-Hsiu Wei, Tainan, TW;
Kei-Wei Chen, Tainan, TW;
Wei-Jen Lo, Hsin-Chu, TW;
Ying-Lang Wang, Tien-Chung Village, TW;
Assignee:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 21/04 (2006.01); B24B 9/06 (2006.01); B24B 21/00 (2006.01);
U.S. Cl.
CPC ...
B24B 9/065 (2013.01); B24B 21/004 (2013.01); B24B 21/04 (2013.01);
Abstract
An embodiment wafer polishing tool includes an abrasive tape, a polish head holding the abrasive tape, and a rotation module. The rotation module is configured to rotate a wafer during a wafer polishing process, and the polish head is configured to apply pressure to the abrasive tape toward a first surface of the wafer during the wafer polishing process.