The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 10, 2016

Filed:

Dec. 17, 2013
Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Inventors:

Lucius Marshall Sherwin, Plano, TX (US);

Jose Antonio Martinez, Murphy, TX (US);

Ronald Charles Roth, McKinney, TX (US);

Sean Christopher O'Brien, Dallas, TX (US);

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G02B 26/00 (2006.01); G02B 26/08 (2006.01); G02F 1/167 (2006.01);
U.S. Cl.
CPC ...
G02B 26/0833 (2013.01); G02F 1/167 (2013.01); G02B 26/005 (2013.01); G02F 2001/1676 (2013.01); G02F 2001/1678 (2013.01);
Abstract

A microelectromechanical (MEMS) device has a movable member supported above a substrate on a via support. The member and via support are fabricated integrally from first and second member forming layers. A first member forming layer forms a lower part of the member and supporting structure for the via support. First and second fill layers are deposited and patterned to form a plug that fills an inner cavity opening in the via structure. The plug is planarized to a planar part of the first member forming layer, and a second member forming layer is deposited over the first member forming layer and the planarized plug to form an upper part of the member. The via support may have a cavity filled by BARC layers.


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