The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 10, 2016

Filed:

Dec. 05, 2012
Applicant:

Kanto Kagaku Kabushiki Kaisha, Tokyo, JP;

Inventors:

Yumiko Taniguchi, Soka, JP;

Kikue Morita, Soka, JP;

Chiyoko Horike, Soka, JP;

Takuo Ohwada, Soka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C11D 7/32 (2006.01); C11D 7/36 (2006.01); C11D 11/00 (2006.01); C23G 1/18 (2006.01); C23G 1/20 (2006.01); H01L 21/02 (2006.01); C11D 3/30 (2006.01); C11D 3/36 (2006.01);
U.S. Cl.
CPC ...
C11D 7/3209 (2013.01); C11D 3/30 (2013.01); C11D 3/361 (2013.01); C11D 7/36 (2013.01); C11D 11/0047 (2013.01); C23G 1/18 (2013.01); C23G 1/20 (2013.01); H01L 21/02052 (2013.01); H01L 21/02068 (2013.01);
Abstract

[Purpose] To provide a cleaning liquid composition that has excellent removability for metallic impurities and particulates, does not cause corrosion of Cu, and can clean a semiconductor substrate having copper wiring in a production process for an electronic device such as a semiconductor device. [Solution means] A cleaning liquid composition for cleaning a semiconductor substrate having copper wiring, the cleaning liquid composition containing one or more types of basic compound containing no metal, and one or more types of phosphonic acid-based chelating agent, and having a hydrogen ion concentration (pH) of 8 to 10.


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