The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 03, 2016
Filed:
Sep. 28, 2012
Toshiki Furutani, Ogaki, JP;
Yukinobu Mikado, Ogaki, JP;
Mitsuhiro Tomikawa, Ogaki, JP;
Tomoya Terakura, Ogaki, JP;
Toshiki Furutani, Ogaki, JP;
Yukinobu Mikado, Ogaki, JP;
Mitsuhiro Tomikawa, Ogaki, JP;
Tomoya Terakura, Ogaki, JP;
IBIDEN Co., Ltd., Ogaki-shi, JP;
Abstract
A method for manufacturing a multilayer printed wiring board includes preparing a metal layer having metal member portions and connector portions connecting the metal member portions, forming laminated multilayer structures having electronic components and the metal member portions, respectively, forming cut penetrating holes in the connector portions of the metal layer, respectively, such that the connector portions of the metal layer are cut, and forming interlayer insulation layers on the laminated multilayer structures such that the laminated multilayer structures are interposed between the interlayer insulation layers. The forming of the interlayer insulation layers includes filling the cut penetrating holes with a resin derived from one or more interlayer insulation layers on the laminated multilayer structures.