The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 03, 2016

Filed:

Mar. 28, 2014
Applicants:

Zigmund Ramirez Camacho, Singapore, SG;

Bartholomew Liao Chung Foh, Singapore, SG;

Sheila Marie L. Alvarez, Singapore, SG;

Dao Nguyen Phu Cuong, Singapore, SG;

Heejo Chi, Yeoju-gun, KR;

Inventors:

Zigmund Ramirez Camacho, Singapore, SG;

Bartholomew Liao Chung Foh, Singapore, SG;

Sheila Marie L. Alvarez, Singapore, SG;

Dao Nguyen Phu Cuong, Singapore, SG;

HeeJo Chi, Yeoju-gun, KR;

Assignee:

STATS ChipPac Ltd., Singapore, SG;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); H01L 23/495 (2006.01); H01L 23/31 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49541 (2013.01); H01L 23/3107 (2013.01); H01L 21/4832 (2013.01); H01L 21/4846 (2013.01); H01L 23/3114 (2013.01); H01L 23/49575 (2013.01);
Abstract

An integrated circuit packaging system, and method of manufacture thereof, includes: lead islands; a pre-molded material surrounding a bottom of the lead islands; a device over a portion of the lead islands and having electrical connections to another portion of the lead islands, the electrical connections over areas of the another portion of the lead islands over areas covered by the pre-molded material; and an encapsulation over the device and the lead islands.


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