The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 26, 2016

Filed:

Jan. 08, 2015
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Renata A. Camillo-Castillo, Essex Junction, VT (US);

Vibhor Jain, Essex Junction, VT (US);

Marwan H. Khater, Astoria, NY (US);

Santosh Sharma, San Diego, CA (US);

Assignee:

GLOBALFOUNDRIES INC., Grand Cayman, KY;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/45 (2006.01); H01L 29/737 (2006.01); H01L 29/08 (2006.01); H01L 29/06 (2006.01); H01L 21/265 (2006.01); H01L 29/40 (2006.01); H01L 29/66 (2006.01); H01L 29/417 (2006.01); H01L 29/423 (2006.01); H01L 29/165 (2006.01); H01L 29/10 (2006.01);
U.S. Cl.
CPC ...
H01L 29/7371 (2013.01); H01L 21/26513 (2013.01); H01L 29/0649 (2013.01); H01L 29/0817 (2013.01); H01L 29/0821 (2013.01); H01L 29/1004 (2013.01); H01L 29/165 (2013.01); H01L 29/407 (2013.01); H01L 29/41708 (2013.01); H01L 29/42304 (2013.01); H01L 29/45 (2013.01); H01L 29/66242 (2013.01);
Abstract

A method of forming a heterojunction bipolar transistor including a field plate. The method may include forming: a substrate having a selectively implanted collector (SIC) and a collector separated by a shallow trench isolation (STI), a field plate in the STI, the field plate extends below a top surface of the SIC, a base layer directly on the SIC, a heterojunction bipolar transistor (HBT) structure above the SIC, the HBT includes an emitter, the emitter is directly on the base layer, a fourth dielectric layer covering the HBT structure, the field plate and the collector, and an emitter contact, a field plate contact and a collector contact extending through the fourth dielectric layer, the emitter contact is in electrical connection with the emitter, the field plate contact is in electrical connection with the field plate and the collector contact is in electrical connection with the collector.

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