The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 26, 2016
Filed:
Oct. 25, 2013
Qualcomm Incorporated, San Diego, CA (US);
Young Kyu Song, San Diego, CA (US);
Daeik Daniel Kim, San Diego, CA (US);
Jonghae Kim, San Diego, CA (US);
Xiaonan Zhang, San Diego, CA (US);
Ryan David Lane, San Diego, CA (US);
Mario Francisco Velez, San Diego, CA (US);
Chengjie Zuo, Santee, CA (US);
Changhan Hobie Yun, San Diego, CA (US);
QUALCOMM Incorporated, San Diego, CA (US);
Abstract
Some novel features pertain to an integrated device that includes a substrate, a first cavity through the substrate, and a toroid inductor configured around the first cavity of the substrate. The toroid inductor includes a set of windings configured around the first cavity. The set of windings includes a first set of interconnects on a first surface of the substrate, a set of though substrate vias (TSVs), and a second set of interconnects on a second surface of the substrate. The first set of interconnects is coupled to the second set of interconnects through the set TSVs. In some implementations, the integrated device further includes an interconnect material (e.g., solder ball) located within the first cavity. The interconnect material is configured to couple a die to a printed circuit board. In some implementations, the interconnect material is part of the toroid inductor.